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Refrigeration & climate3 min readLast updated September 2026

Data centre cooling: when air is sufficient and when water must take over

Cold aisle or hot aisle, rear-door cooler or direct-to-chip: the choice of cooling system determines the floor space, energy consumption and waste heat utilisation of a data centre. The deciding factor is not fashion, but the heat output per rack.

Key points

  • For conventional IT with moderate power density, air cooling with cold or hot aisle containment remains the state of the art.
  • The biggest efficiency lever in air cooling is demand-controlled airflow, not the choice between cold and hot aisle.
  • At high power densities, water takes over, because per unit of volume it absorbs around 3500 times more heat than air.
  • Warm-water cooling saves chiller operating hours and supplies waste heat at a temperature level that can be used.

01The question in almost every project

Is cold aisle containment still up to date, or are we planning a model that is being phased out? The question has arisen since racks for AI applications began to give off many times the heat of conventional servers. The answer is nuanced: aisle containment remains the basis – but it is no longer the right solution for every rack.

02The typical fallacy

There is often lengthy discussion about cold or hot aisle. In energy terms, both variants are close to each other. What matters is that the supply airflow follows the actual IT load: a control system maintains a slight differential pressure of a few pascals between the cold and warm zones and continuously adjusts the speed of the computer room air handlers. Because fan power rises roughly with the cube of the speed, even a moderate reduction in airflow saves a lot of electricity.

The differences lie elsewhere. The hot aisle keeps the room cool and offers more thermal reserve in the event of a cooling failure, but requires a return air path via the ceiling – more of a new-build solution. The cold aisle is easier to retrofit into existing rows.

03The principle: power density decides

Air has a low heat capacity. Per unit of volume and kelvin, water absorbs around 3500 times more heat. Above a certain power per rack, the required airflows can therefore no longer be moved sensibly. Three stages then follow:

  • Rear-door heat exchanger: a water-cooled coil replaces the rear door of the rack and can be retrofitted. The flow temperature must remain above the dew point of the room air, otherwise condensate forms.
  • Direct-to-chip: cold plates remove most of the heat directly from processors and graphics chips; the remainder is still air-cooled. A coolant distribution unit separates the rack circuit from the building network; leak monitoring and redundant pumps are mandatory.
  • Immersion: the servers are immersed in a non-conductive liquid. This enables the highest densities, but fundamentally changes maintenance and spare parts logistics.
Guide values: air containment up to approx. 20 to 30 kW per rack, rear-door heat exchanger approx. 15 to 60 kW, direct-to-chip approx. 40 to over 130 kW, immersion from approx. 100 kW; the transitions are fluid.COOLING SYSTEM BY POWER DENSITYCold/hot aisle containmentAirRear-door heat exchangerAir/waterDirect-to-chipWater at the chipImmersionImmersion cooling020406080100120140160+Heat load per rack in kW (guide values)
Which cooling system suits which power density Guide values from technical literature and manufacturer data; transitions are gradual

04Warm water is the goal

The ASHRAE guidelines for liquid cooling classify systems according to the maximum supply temperature of the cooling water, from 17 to over 45 °C. The higher this temperature, the more often dry coolers without a chiller are sufficient – and the more valuable the waste heat becomes for heating purposes.

ASHRAE liquid cooling classes W17, W27, W32, W40, W45 and W+ with maximum supply temperatures from 17 to over 45 °C. Low classes need chillers; high classes manage without and deliver usable waste heat.MAXIMUM COOLING WATER SUPPLY TEMPERATURE BY ASHRAE CLASS17 °CW1727 °CW2732 °CW3240 °CW4045 °CW45> 45 °CW+Chiller + heat rejectionfree cooling at timesmostly without chillerwaste heat usable via heat pumpwithout chillerwaste heat directly into low-temperature networks
Higher cooling water temperature: less chiller operation, more usable waste heat ASHRAE TC 9.9, Thermal Guidelines (2021), liquid cooling classes

05What this means for your project

  • Determine the power density per rack for today and for the planned expansion – it determines the system, not the other way round.
  • Plan zones: air-cooled rows for standard IT and liquid-cooled rows for dense racks are not mutually exclusive.
  • Provide cooling water connections, load-bearing capacity and leak protection, even if liquid cooling will only come later.
  • Clarify waste heat utilisation early. In the EU, data centres with a rated power of more than 1 MW must use their waste heat, provided this is technically and economically feasible; in Switzerland, individual cantons set their own efficiency requirements.

Properly planned, the waste heat becomes a heat source: a large-scale heat pump can raise it to the temperature level of a district heating network. Anergy networks, which take up waste heat directly, are also suitable as consumers.

Takeaway

It is not the direction of containment that decides, but power density: air for standard IT, water for dense racks – and the water temperature as high as possible so that free cooling and waste heat utilisation work.

Standards and sources

  • ASHRAE TC 9.9 – Thermal Guidelines for Data Processing Environments, 5th edition (2021)
  • ASHRAE TC 9.9 – Emergence and Expansion of Liquid Cooling in Mainstream Data Centers (White Paper)
  • EN 50600-4-2 – Data centre facilities and infrastructures, key performance indicator Power Usage Effectiveness (PUE); EN 50600-4-6 – Energy Reuse Factor (ERF)
  • Directive (EU) 2023/1791 on energy efficiency, Art. 12 and Art. 26(6); Delegated Regulation (EU) 2024/1364
  • SwissEnergy / SFOE – Abwärmenutzung von Rechenzentren: Potenzialstudie und Empfehlungen (waste heat utilisation from data centres: potential study and recommendations, 2023); guide to data centres for cantons and municipalities

SEDC AG · Article from our internal training series “Technik Praxis”, abridged for clients and users.

Full version & expert discussion

More depth for your project.

The full version contains the schematic diagrams of all cooling systems with control loops and instrumentation, the design of the differential pressure control, the dew point regime for rear-door coolers, and a decision matrix by power density, existing building and waste heat utilisation. We are happy to go through it with you – applied to your installation.

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